DTF Low-Melt Adhesive Powder

Lower temperature. Faster transfers. More versatility.

Reduce heat press dwell time to as low as 2–5 seconds, depending on the substrate.

The DTF Low-Melt Adhesive Powder is designed to activate at lower temperatures while remaining fully compatible with your existing DTF system. It’s ideal for heat-sensitive substrates and applications where speed is a priority.

Key Benefits:

• Lower activation temperature
  Reduces the risk of damaging soft plastics and other heat-sensitive materials.
• Faster production times
  Transfer times can be reduced from approximately 10 seconds to as low as 2–5 seconds, depending on the substrate.
• Compatible with current workflows
  No changes required to your existing DTF equipment or process.

Performance Notes:

• Adhesion remains strong across a variety of materials
• Wash durability is slightly lower than standard DTF adhesive powders
• Optimal press time and temperature will vary by substrate (cotton, polyester, etc.)

Recommended For:

• Heat-sensitive materials
• Promotional products
• High-speed production environments